Download e-book for iPad: Advances in CMP Polishing Technologies by Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa

By Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa

CMP and sprucing are the main distinct approaches used to complete the surfaces of mechanical and digital or semiconductor parts. Advances in CMP/Polishing applied sciences for Manufacture of digital units provides the newest advancements and technological concepts within the box – making state of the art R&D available to the broader engineering group.

Most of the functions of those strategies are saved as exclusive as attainable (proprietary information), and particular information will not be visible in expert or technical journals and magazines. This publication makes those tactics and purposes obtainable to a much wider commercial and educational audience.

Building at the basics of tribology – the technological know-how of friction, put on and lubrication – the authors discover the sensible functions of CMP and sharpening throughout a number of industry sectors. as a result of the excessive velocity of improvement of the electronics and semiconductors undefined, some of the provided tactics and functions come from those industries.

  • Demystifies medical advancements and technological recommendations, commencing them up for brand spanking new purposes and procedure advancements within the semiconductor and different components of precision engineering
  • Explores inventory elimination mechanisms in CMP and sprucing, and the demanding situations interested by predicting the results of abrasive procedures in high-precision environments
  • The authors compile the newest concepts and learn from america and Japan

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Advances in CMP Polishing Technologies by Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa


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